意思翻译
管芯焊接[连接],小片结法
芯片焊接
相关相似bid bond───[金融]押标金;[金融]投标保证金;履约保证金
in bond───(进口货物)在关栈中;[税收]保税
dative bond───配价键
indie band───独立乐队
bail bond───[法]保释保证书
bid bonds───[金融]押标金;[金融]投标保证金;履约保证金
clip bond───夹式键合
双语场合用语Figure 2 illustrates the fundamental aspects of a die bond.───图2所示为管芯连接的基本结构。
of MOSFET is consisted of five main processes, which are wafer sawing, die attach, wire bond, molding, trim and form.───MOSFET的封装主要由晶圆切割,晶粒黏贴,焊线,封塑,切割成型这五大流程组成。
In this paper, an improvement example of die shear strength and bond strength of a microwave module is introduced.───本文介绍了某微波组件芯片剪切力和键合强度的改进案例。
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